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	<title>Mary Scott NabersAdditional $1.6 billion to help U.S. regain chip leadership - Mary Scott Nabers</title>
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	<title>Additional $1.6 billion to help U.S. regain chip leadership - Mary Scott Nabers</title>
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		<title>Additional $1.6 billion to help U.S. regain chip leadership</title>
		<link>https://maryscottnabers.com/2024/07/12/additional-1-6-billion-to-help-u-s-regain-chip-leadership/</link>
		<comments>https://maryscottnabers.com/2024/07/12/additional-1-6-billion-to-help-u-s-regain-chip-leadership/#respond</comments>
		<pubDate>Fri, 12 Jul 2024 05:05:00 +0000</pubDate>
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				<description><![CDATA[<p><img width="150" height="150" src="https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-150x150.jpeg" class="attachment-thumbnail size-thumbnail wp-post-image" alt="" decoding="async" srcset="https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-150x150.jpeg 150w, https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-35x35.jpeg 35w" sizes="(max-width: 150px) 100vw, 150px" />The U.S. Department of Commerce has announced a Notice of Intent (NOI) to solicit research and development (R&#38;D) activities that will help establish and accelerate domestic capacity for advanced semiconductor packaging. The CHIPS for America program plans to allocate up to $1.6 billion to fund innovation across five R&#38;D areas, as described in the vision [&#8230;]</p>
<p>The post <a rel="nofollow" href="https://maryscottnabers.com/2024/07/12/additional-1-6-billion-to-help-u-s-regain-chip-leadership/">Additional $1.6 billion to help U.S. regain chip leadership</a> appeared first on <a rel="nofollow" href="https://maryscottnabers.com">Mary Scott Nabers</a>.</p>
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			<content:encoded><![CDATA[<p><img width="150" height="150" src="https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-150x150.jpeg" class="attachment-thumbnail size-thumbnail wp-post-image" alt="" decoding="async" srcset="https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-150x150.jpeg 150w, https://maryscottnabers.com/wp-content/uploads/2024/07/anne-nygard-cA8VTQeHU0c-unsplash-scaled-7W0ljM-35x35.jpeg 35w" sizes="(max-width: 150px) 100vw, 150px" />The U.S. Department of Commerce has announced a Notice of Intent (NOI) to solicit research and development (R&#38;D) activities that will help establish and accelerate domestic capacity for advanced semiconductor packaging. The CHIPS for America program plans to allocate up to $1.6 billion to fund innovation across five R&#38;D areas, as described in the vision [&#8230;]</p>
<p>The post <a rel="nofollow" href="https://maryscottnabers.com/2024/07/12/additional-1-6-billion-to-help-u-s-regain-chip-leadership/">Additional $1.6 billion to help U.S. regain chip leadership</a> appeared first on <a rel="nofollow" href="https://maryscottnabers.com">Mary Scott Nabers</a>.</p>
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