Mary Scott Nabers$1.4 billion awarded for domestic semiconductor packaging research, development - Mary Scott Nabers https://maryscottnabers.com Fri, 19 Jun 2026 18:13:59 +0000 en-US hourly 1 https://maryscottnabers.com/wp-content/uploads/2018/06/cropped-Web-Mary-Scott-Nabers-6813-Edit-Edit-Crop-32x32.jpg $1.4 billion awarded for domestic semiconductor packaging research, development - Mary Scott Nabers https://maryscottnabers.com 32 32 $1.4 billion awarded for domestic semiconductor packaging research, development https://maryscottnabers.com/2025/01/28/1-4-billion-awarded-for-domestic-semiconductor-packaging-research-development/ https://maryscottnabers.com/2025/01/28/1-4-billion-awarded-for-domestic-semiconductor-packaging-research-development/#respond Tue, 28 Jan 2025 06:03:00 +0000 https://maryscottnabers.com/2025/01/28/1-4-billion-awarded-for-domestic-semiconductor-packaging-research-development/ The U.S. Department of Commerce (DOC) is allocating $1.4 billion in funding to research and develop advanced packaging and enable new technologies that reinforce national leadership in semiconductor manufacturing.  The federal funding, part of the CHIPS for America agenda, looks to establish domestic capacity for advanced semiconductor packaging and accelerate the development of these technologies […]

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]]> The U.S. Department of Commerce (DOC) is allocating $1.4 billion in funding to research and develop advanced packaging and enable new technologies that reinforce national leadership in semiconductor manufacturing.  The federal funding, part of the CHIPS for America agenda, looks to establish domestic capacity for advanced semiconductor packaging and accelerate the development of these technologies […]

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